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Taiwan Semiconductor (NYSE:TSM) has reportedly installed the first extreme ultraviolet lithography machine at its Arizona manufacturing fab.
The global foundry acquired the EUV machine from ASML Holding (ASML) thanks to ASML and its suppliers, Focus Taiwan reported, citing sources close to the situation.
The EUV machine enables Taiwan Semiconductor (TSM) and other chip manufacturers to print complex designs on microprocessors.
Last month, Taiwan Semiconductor (TSM) pushed back the start of production from its new plant to 2025 from 2024.
The company has been sending workers from Taiwan to Arizona to ramp up the factory. In total, Taiwan Semiconductor (TSM) is investing $40B into two wafer fabs in Phoenix as part of its global expansion and diversification.
Earlier this month, Taiwan Semiconductor (TSM) formed a joint venture to build a fab in Germany with German semiconductor companies Bosch, NXP Semiconductors and Infineon.
The first Arizona plant is building 5 nanometer chips and a second facility is expected to produce 3 nanometer chips. The 3 nm chip facility is slated to be ready for production by 2026.
Taiwan Semiconductor (TSM) Chairman Mark Liu said at a December 2022 event that more than 600,000 wafers would be manufactured per year at the plant, accounting for $10B in annual revenue.
Taiwan Semiconductor’s (TSM) push into Arizona is partly the result of the U.S. CHIPs Act, which was signed into law in August 2022.
The $52.7B CHIPs Act includes subsidies for domestic production and an investment tax credit for chip plants that could be worth an estimated $24B over the next decade. The legislation was designed to reduce the reliance of foreign semiconductor production amid increasing geopolitical tensions, particularly with China.
In April, it was reported that Taiwan Semiconductor (TSM) was pushing back on some of the more controversial parts of the legislation.
Taiwan Semiconductor (TSM) shares rose slightly more than 0.5% in mid-day trading on Monday.